Product

SO is a metal pin holder with the same pins as the corresponding DIP package. SO is about 30~50% less space and about 70% thinner than the equivalent DIP package. SSOP (Shrink Small Outline Package) has teminals on both sides and the pin pitch is less than 1.0mm. TSSOP (Thin Shrink Small Outline Package) size is width less than 300mils and the product height less than 1.2mm. The finished product is mainly applying in micro MCU controller, memory Body, automotive IC, mobile phone, consumer electronics, etc.